kenji ToyosawaYasunori Chikawa

Abstract
Recently, SOF is increasingly used as the package for LCD drivers, replacing previously used TCP. The pitch of inner-lead connection could be reduced to less than 40µm in SOF, as compared to the limiting value of 40µm in TCP. We have developed a 35µm fine-pitch-SOF technology, utilizing the present SOF and a zigzag-pad-layout ILB technology. As the first supplier of the fine-pitch-SOF, Sharp has started mass production in January 2003.